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omnidirectional microphone with bottom port and digital output admp421 rev. a information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication or otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062-9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ?2010C2011 analog devices, inc. all rights reserved. features small and thin 3 mm 4 mm 1 mm surface-mount package high snr of 61 dba high sensitivity of ?26 dbfs flat frequency response from 100 hz to 15 khz low current consumption: <650 a sleep mode for extended battery life high psrr of 80 dbfs fourth-order - modulator digital pdm output compatible with sn/pb and pb-free solder processes rohs/weee compliant applications smartphones and feature phones teleconferencing systems digital video cameras bluetooth headsets video phones tablets general description the admp421 is a high performance, low power, digital output bottom-ported omnidirectional mems microphone. the admp421 consists of a mems microphone element and an impedance converter amplifier followed by a fourth-order - modulator. the digital interface allows for the pulse density modulated (pdm) output of two microphones to be time- multiplexed on a single data line using a single clock. the admp421 has a high snr and high sensitivity, making it an excellent choice for far field applications. the admp421 has a flat wideband frequency response, resulting in natural sound with high intelligibility. low current consumption and a sleep mode enable long battery life for portable applications. a built- in particle filter provides high reliability. the admp421 complies with the tia-920 telecommunications telephone ter minal equipment transmission requirements for wideband digital wireline telephones standard. the admp421 is available in a thin 3 mm 4 mm 1 mm surface-mount package. it is reflow solder compatible with no sensitivity degradation. the admp421 is halide free. functional block diagram a sic data l/r select clk v dd gnd mems membrane backplate 07596-001 impedance converter adc admp421 figure 1.
admp421 rev. a | page 2 of 16 table of contents features .............................................................................................. 1 ? applications....................................................................................... 1 ? general description ......................................................................... 1 ? functional block diagram .............................................................. 1 ? revision history ............................................................................... 2 ? specifications..................................................................................... 3 ? timing characteristics ................................................................ 4 ? absolute maximum ratings............................................................ 5 ? esd caution.................................................................................. 5 ? pin configuration and function descriptions............................. 6 ? typical performance characteristics ............................................. 7 ? power-saving features ..................................................................... 8 ? sleep mode .................................................................................... 8 ? power savings when disabling one microphone in a multimicrophone application.....................................................8 ? pcb land pattern layout.................................................................9 ? evaluation board ............................................................................ 10 ? interfacing with analog devices codecs ................................... 11 ? handling instructions.................................................................... 12 ? pick-and-place equipment ....................................................... 12 ? reflow solder .............................................................................. 12 ? board wash ................................................................................. 12 ? reliability specifications................................................................ 13 ? outline dimensions ....................................................................... 14 ? ordering guide .......................................................................... 14 ? revision history 2/11rev. 0 to rev. a changes to features section, applications section, and general description section....................................................... 1 added dynamic range parameter, changes to input characteristics parameter and output characteristics parameter, deleted polarity parameter, table 1 ....................... 3 changes to table 3............................................................................ 5 changes to table 5............................................................................ 6 added power-saving features section .......................................... 8 updated outline dimensions ....................................................... 13 changes to ordering guide .......................................................... 13 4/10revision 0: initial version
admp421 rev. a | page 3 of 16 specifications t a = 25c, v dd = 1.8 v, clk = 2.4 mhz, unless otherwise noted. all minimum and maximum specifications are guaranteed. typical specifications are not guaranteed. table 1. parameter symbol test conditions/comments min typ max unit performance directionality omni sensitivity 1 1 khz, 94 db spl ?29 ?26 ?23 dbfs signal-to-noise ratio snr 20 khz bandwidth, a-weighted 61 dba equivalent input noise ein 20 khz bandwidth, a-weighted 33 dba spl dynamic range derived from ein and maximum acoustic input 87 db frequency response 2 low frequency ?3 db point 100 hz high frequency ?3 db point 15 khz deviation limits from flat response within pass band ?3/+2 db total harmonic distortion thd 105 db spl 3 % power supply rejection ratio psrr 217 hz, 100 mv p-p square wave superimposed on v dd = 1.8 v 80 dbfs maximum acoustic input peak 120 db spl input characteristics clock frequency clk 2.4 3 mhz clock duty ratio clock frequency of 2.4 mhz or less 40 60 % input voltage high v ih 0.65 v dd v input voltage low v il 0.35 v dd v supply voltage v dd 1.65 3.6 v supply current i s normal mode 650 a sleep mode 4 50 a output characteristics output voltage high v oh i load = 0.5 ma 0.7 v dd v dd v output voltage low v ol i load = 0.5 ma 0 0.3 v dd v latency <30 s wake-up time from sleep mode, power on 10 ms 1 relative to the rms level of a sine wave with posi tive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1 s density. 2 see and . figure 5 figure 6 3 the microphone operates at any clock frequency between 1.0 mhz and 3.3 mhz. some specifications may not be guaranteed at frequ encies other than 2.4 mhz. 4 the microphone enters sleep mode when the clock is turned off or the clock frequency is less than 1 khz.
admp421 rev. a | page 4 of 16 timing characteristics table 2. parameter description min max unit input t clkin input clock period 310 1000 ns output t 1outen data1 driven after falling clock edge 30 ns t 1outdis data1 disabled after rising clock edge 20 ns t 2outen data2 driven after rising clock edge 30 ns t 2outdis data2 disabled after falling clock edge 20 ns timing diagram t clkin clk data2 data1 07596-002 t 2outdis t 1outdis t 2outen t 1outen figure 2. pulse density modulated output timing
admp421 rev. a | page 5 of 16 absolute maximum ratings table 3. stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. parameter rating supply voltage ?0.3 v to 3.6 v digital pin input voltage ?0.3 v to v dd + 0.3 v or 3.6 v, whichever is less sound pressure level (spl) 160 db mechanical shock 10,000 g vibration per mil-std-883 method 2007, test condition b temperature range ?40c to +70c esd caution 07596-003 t p t l t 25c to peak t s preheat critical zone t l to t p temper a ture time ramp-down ramp-up t smin t smax t p t l figure 3. recommended soldering profile limits table 4. recommended soldering profile limits profile feature sn63/pb37 pb free average ramp rate (t l to t p ) 3c/sec max 3c/sec max preheat minimum temperature (t smin ) 100c 150c maximum temperature (t smax ) 150c 200c time (t smin to t smax ), t s 60 sec to 120 sec 60 sec to 120 sec ramp-up rate (t smax to t l ) 3c/sec 3c/sec time maintained above liquidous (t l ) 60 sec to 150 sec 60 sec to 150 sec liquidous temperature (t l ) 183c 217c peak temperature (t p ) 240c +0c/?5c 260c +0c/?5c time within 5c of actual peak temperature (t p ) 10 sec to 30 sec 20 sec to 40 sec ramp-down rate 6c/sec max 6c/sec max time 25c (t25c) to peak temp erature 6 minute max 8 minute max
admp421 rev. a | page 6 of 16 pin configuration and fu nction descriptions 1 2 3 clk l/r select gnd data v dd 4 5 0 7596-007 figure 4. pin configuration (bottom view) table 5. pin function descriptions pin no. mnemonic description 1 clk clock input to microphone. 2 l/r select left channel or right channel select. data1 (right): l/r select tied to gnd. data2 (left): l/r select pulled to v dd . 3 gnd ground. 4 v dd power supply. placing a 0.1 f (100 nf) ceramic type x7r capacitor between pin 4 (v dd ) and ground is strongly recommended for best performance and to avoid potential pa rasitic artifacts. the capacitor should be placed as close to pin 4 as possible. 5 data digital output signal (data1, data2).
admp421 rev. a | page 7 of 16 typical performance characteristics ?10 ?8 ?6 ?4 ?2 0 2 4 6 8 10 100 10k 1k 07596-004 frequency (hz) (db) figure 5. frequency response mask 10 0 ?10 ?20 100 1k 10k frequency (hz) (db) 07596-005 figure 6. typical frequency response (measured) ?100 ?90 ?80 ?70 ?60 ?50 ? 40 200 500 1k 2k 5k 10k 20k 07596-006 frequency (hz) psrr (dbfs) figure 7. typical power supply rejection ratio vs. frequency
admp421 rev. a | page 8 of 16 power-saving features sleep mode the microphone enters sleep mode when the clock is turned off or the clock frequency falls below 1 khz. in sleep mode, the microphone data output is in high impedance state and the current consumption is less than 50 a. power savings when disabling one microphone in a multimicrophone application the admp421 has a unique power-saving feature when used in systems where two or more microphones share the same clock and/or data lines. the microphone is designed to present high impedance on both the clock and data pins when the power supply (v dd ) pin is at 0 v or floating. this disabled microphone presents no load to and consumes no power from other active microphones.
admp421 rev. a | page 9 of 16 pcb land pattern layout the recommended pcb land pattern for the admp421 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in figure 8 . care should be taken to avoid applying solder paste to the sound hole in the pcb. a suggested solder paste stencil pattern layout is shown in figure 9 . the diameter of the sound hole in the pcb should be larger than the diameter of the sound port of the microphone. a minimum diameter of 0.5 mm is recommended. 4 0.40 0.60 (0.30) 0.90 (0.30) ?1.70 3.80 (0.30) 0.35 2.80 2 r0.10 (0.30) 0.35 2.05 0.70 ?1.10 07596-008 figure 8. suggested pcb land pattern layout 1.45 0.9 2.45 0.7 1.525 1.498 0.205 wide 0.248 0.498 (2) 0.248 1.148 (2) 0.248 0.948 (2) 1.498 0.248 0.398 0.298 (4) 0.362 cut (3) 1.17 07596-009 figure 9. suggested solder paste stencil pattern layout
admp421 rev. a | page 10 of 16 evaluation board figure 10 and figure 11 show the admp421 evaluation board schematic and layout, respectively. the admp421 evaluation board is designed to plug directly into connector j6 on the analog devices, inc., eval-adau1761z . u1 admp421 1 2 3 4 5 5 3 4 1 2 6 7 8 9 10 11 12 clk c1 0.1f gnd p1 lrsel data v dd clk v dd data l/r select gnd 07596-010 figure 10. admp421 evaluation board schematic analog devices admp421 c1 u1 07596-011 1 2 11 12 figure 11. admp421 evaluation board layout table 6. evaluation board connector pin functions pin no. description pin no. description 1 gnd 2 not connected 3 clk 4 not connected 5 not connected 6 not connected 7 l/r select 8 not connected 9 data 10 not connected 11 v dd 12 not connected
admp421 rev. a | page 11 of 16 interfacing with analog devices codecs analog devices adau1361 and adau1761 codecs feature digital microphone inputs that support the admp421 pdm output data format. see the connection diagrams shown in figure 12 and figure 13 , and refer to the an-1003 application note and the codecs respective data sheets for more details on the digital microphone interface. 07596-013 jdfunc[1:0] digital microphone interface left channel right channel to jack detection circuit jackdet/micin right adc left adc decimators r19: adc control insel r2: digital microphone/ jack detection control figure 12. digital microphone signal routing block diagram admp421 digital microphone clk bclk linp cm v dd l/r select gnd data 0.1f admp421 digital microphone clk bclk v dd l/r select gnd data 0.1f micbias linn rinn rinp jackdet/micin adau1361 or adau1761 07596-012 figure 13. adau1361 and adau1761 stereo interface block diagram
admp421 rev. a | page 12 of 16 handling instructions pick-and-place equipment the mems microphone can be handled using standard pick- and-place and chip shooting equipment. care should be taken to avoid damage to the mems microphone structure as follows: ? use a standard pickup tool to handle the microphone. because the microphone hole is on the bottom of the package, the pickup tool can make contact with any part of the lid surface. ? use care during pick-and-place to ensure that no high shock events above 20 k g are experienced because such events may cause damage to the microphone. ? do not pick up the microphone with a vacuum tool that makes contact with the bottom side of the microphone. do not pull air out of or blow air into the microphone port. ? do not use excessive force to place the microphone on the pcb. reflow solder for best results, the soldering profile should be in accordance with the recommendations of the manufacturer of the solder paste used to attach the mems microphone to the pcb. it is recommended that the solder reflow profile not exceed the limit conditions specified in figure 3 and table 4 . board wash when washing the pcb, ensure that water does not make contact with the microphone port. blow-off procedures and ultrasonic cleaning must not be used.
admp421 rev. a | page 13 of 16 reliability specifications the microphone sensitivity after stress must deviate by no more than 3 db from the initial value. table 7. stress test description low temperature operating life ?40c, 500 hours, powered high temperature operating life +125c, 500 hours, powered temperature humidity bias (thb) +65c/85% relative humidity (rh), 500 hours, powered temperature cycle ?40c/+125c, one cycle per hour, 100 cycles high temperature storage 150c, 500 hours low temperature storage ?40c, 500 hours component cdm esd all pins, 0.5 kv component hbm esd all pins, 1.5 kv component mm esd all pins, 0.2 kv
admp421 rev. a | page 14 of 16 outline dimensions 06-16-2010-g 1.50 2.80 bottom view top view side view r e f e r e n c e c o r n e r 4.10 4.00 3.90 3.10 3.00 2.90 12 3 4 5 0.90 2.48 ref 0.72 ref 3.54 ref 1.05 ref 2.05 3.80 0.70 0.30 ref 0.25 dia. (thru hole) 1.10 dia. r0.10(2 ) 1.70 dia. 0.95 ref 0.35 0.35 0.30 ref 0.30 ref 1.10 1.00 0.90 0.24 ref 0 . 4 0 0 . 6 0 ( p i n s 1 , 2 , 4 , 5 ) 0.30 ref p i n 1 figure 14. 5-terminal chip array small outline no lead cavity [lga_cav] 4 mm 3 mm body (ce-5-1) dimensions shown in millimeters 12.30 12.00 11.70 062408-a notes: 1. 10 sprocket hole pitch cumulative tolerance 0.20. 2. pocket position relative to sprocket hole measured as true position of pocket, not pocket hole. 4.80 3.20 1.50 min dia 8.00 4.00 1 1.60 max 1.50 nom a a section a-a 2.05 2 2.00 1.95 0.20 max 1.30 ref 1.60 0.35 0.30 0.25 3.80 2.20 1.85 1.75 1.65 5.55 2 5.50 5.45 detail a 0.50 r 0.25 0.25 detail a figure 15. lga_cav tape an d reel outline dimensions dimensions shown in millimeters ordering guide model 1 temperature range package description package option 2 ordering quantity ADMP421ACEZ-RL ?40c to +70c 5-terminal lga_cav, 13 tape and reel ce-5-1 5,000 ADMP421ACEZ-RL7 ?40c to +70c 5-terminal lga_cav, 7 tape and reel ce-5-1 1,000 eval-admp421z evaluation board eval-admp421z-flex flex evaluation board 1 z = rohs compliant part. 2 this package option is halide free.
admp421 rev. a | page 15 of 16 notes
admp421 rev. a | page 16 of 16 notes ?2010C2011 analog devices, inc. all rights reserved. trademarks and registered trademarks are the prop erty of their respective owners. d07596-0-2/11(a)

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